Atv750b(l), Packaging information, Controlling dimension: millimeters – Rainbow Electronics ATV750BL User Manual

Page 17

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17

Packaging Information

ATV750B(L)

0301I–08/01

.045(1.14) X 45°

PIN NO. 1
IDENTIFY

.032(.813)
.026(.660)

.050(1.27) TYP

.300(7.62) REF SQ

.045(1.14) X 30° - 45°

.022(.559) X 45° MAX (3X)

.012(.305)
.008(.203)

.021(.533)
.013(.330)

.430(10.9)
.390(9.91)

SQ

.043(1.09)
.020(.508)
.120(3.05)
.090(2.29)

.180(4.57)
.165(4.19)

.456(11.6)
.450(11.4)

.495(12.6)
.485(12.3)

SQ

SQ

*Controlling dimension: millimeters

1.27(32.3)
1.25(31.7)

PIN

1

.266(6.76)
.250(6.35)

.090(2.29)

MAX

.005(.127)

MIN

.070(1.78)
.020(.508)

.023(.584)
.014(.356)

.065(1.65)
.040(1.02)

.325(8.26)
.300(7.62)

0

15

REF

.400(10.2) MAX

.012(.305)
.008(.203)

.110(2.79)
.090(2.29)

.151(3.84)
.125(3.18)

SEATING

PLANE

.200(5.06)

MAX

1.100(27.94) REF

24DW3, 24-lead, 0.300" Wide, WIndowed, Ceramic
Dual Inline Package (Cerdip)
Dimensions in Inches and (Millimeters)

MIL-STD-1835 D-9 CONFIG A

28J, 28-lead, Plastic J-leaded Chip Carrier (PLCC)
Dimensions in Inches and (Millimeters)

JEDEC STANDARD MS-018 AB

28LW, 28-pad, Windowed, Ceramic Leadless Chip
Carrier (LCC)
Dimensions in Inches and (Millimeters)*

MIL-STD-1835 C-4

24P3, 24-lead, 0.300" Wide, Plastic Dual Inline
Package (PDIP)
Dimensions in Inches and (Millimeters)

JEDEC STANDARD MS-001 AF

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