Rainbow Electronics DS1644P - Manual (Page 10)

DS1644/DS1644P
10 of 11
DS1644 28-PIN PACKAGE
PKG 28-PIN
DIM MIN MAX
A IN.
MM 1.470
37.34 1.490
37.85
B IN.
MM 0.715
18.16 0.740
18.80
C IN.
MM 0.335
8.51 0.365
9.27
D IN.
MM 0.075
1.91 0.105
2.67
E IN.
MM 0.015
0.38 0.030
0.76
F IN.
MM 0.140
3.56 0.180
4.57
G IN.
MM 0.090
2.29 0.110
2.79
H IN.
MM 0.590
14.99 0.630
16.00
J IN.
MM 0.010
0.25 0.018
0.45
K IN.
MM 0.015
0.38 0.025
0.64
DS1644P
PKG INCHES
DIM MIN NOM MAX
A 0.920 0.925 0.930
B 0.980 0.985 0.990
C - - 0.080
D 0.052 0.055 0.058
E 0.048 0.050 0.052
F 0.015 0.020 0.025
G 0.025 0.027 0.030
NOTE:
For the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
solder reflow oriented with the label side up (“live - bug”).
b. Hand Soldering and touch - up: Do not touch or apply the soldering iron to leads for more than
3 (three) seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To
remove the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick
to remove solder.