Rainbow Electronics DS1554 - Manual (Page 18)

DS1554
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DS1554P
NOTE:
Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder
reflow oriented with the label side up (“live-bug”).
Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than 3 seconds.
To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part, apply flux,
heat the lead frame pad until the solder reflows and use a solder wick to remove solder.
PKG INCHES
DIM MIN NOM MAX
A 0.920 0.925 0.930
B 0.980 0.985 0.990
C - - 0.080
D 0.052 0.055 0.058
E 0.048 0.050 0.052
F 0.015 0.020 0.025
G 0.025 0.027 0.030