SENA Parani-BCD100 - Manual (Page 19)

PARANI-BCD100
Page 19 of 22
7. Solder Profiles
The soldering profile depends on various parameters necessitating a set up for each application. The data
here is given only for guidance on solder re-flow. There are four zones:
z Preheat Zone – This zone raises the temperature at a controlled rate, typically 1-2.5°C /s
z Equilibrium Zone – This zone brings the board to a uniform temperature and also activates the flux.
The duration in this zone (typically 2-3 minutes) will need to be adjusted to optimize the out gassing
of the flux.
z Reflow Zone – The peak temperature should be high enough to achieve good wetting but not so
high as to cause component discoloration or damage. Excessive soldering time can lead to
intermetallic growth which can result in a brittle joint.
z Cooling Zone – The cooling rate should be fast, to keep the solder grains small which will give a
longer lasting joint. Typical rates will be 2-5°C/s
Figure 7-1 Typical Lead-Free Re-flow Solder Profile
Key features of the profile:
z Initial Ramp = 1-2.5°C/sec to 175°C±25°C equilibrium
z Equilibrium time = 60 to 180 seconds
z Ramp to Maximum temperature (245°C) = 3°C/sec max.
z Time above liquids temperature (217°C): 45~90 seconds
z Device absolute maximum reflow temperature: 260°C
The BCD100 will withstand the specified profile up to two reflows to a maximum temperature of 260°C