Data sheet, Post solder cleaning and drying considerations, Emc considerations – GE Industrial Solutions EBVW020A0B Barracuda Series User Manual

Page 12

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GE

Data Sheet

EBVW020A0B Barracuda Series; DC-DC Converter Power Modules

36-75Vdc Input; 12.0Vdc, 20.0A, 240W Output

July 22, 2013

©2012 General Electric Company. All rights reserved.

Page 12

detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface Mount Devices).

Moisture barrier bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages should not be
broken until time of use. Once the original package is broken,
the floor life of the product at conditions of 30°C and 60%
relative humidity varies according to the MSL rating (see J-STD-
025A). The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when stored at
the following conditions: < 40° C, < 90% relative humidity.

Post Solder Cleaning and Drying
Considerations

Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability of

a power module and the testability of the finished circuit-board
assembly. For guidance on appropriate soldering, cleaning and
drying procedures, refer to GE Board Mounted Power Modules:
Soldering and Cleaning
Application Note (AP01-056EPS).


EMC Considerations

The circuit and plots in Figure 24 shows a suggested
configuration to meet the conducted emission limits of

EN55022 Class B. For further information on designing for EMC
compliance, please refer to the FLT007A0 data sheet.

Figure 24. EMC Considerations.

0

10

20

30

40

50

60

70

80

Level [dBµV]

150k

300k

500k

1M

2M

3M

4M 5M

7M

10M

30M

Frequency [Hz]

+

+

+

+

+

+

x

x

x

x

x

x

x x

MES CE0916111952_fin QP

+ +

MES CE0916111952_fin AV
MES CE0916111952_pre PK
MES CE0916111952_pre AV

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