GE Industrial Solutions EBVW017A0S14R0 Series - Manual (Page 9)

Data Sheet
April 11, 2013 EBVW017A0S14R0 Series Power Modules; DC-DC Converters
36-75V
dc
Input; 14.0V
dc
Output; 17A Output Current
LINEAGE POWER 9
Figure 19. Location of the thermal reference
temperature TH
2
for Base Plate module. Do not exceed
110 °C.
OU
TPU
T
C
URRENT,
I O
(A)
LOCAL AMBIENT TEMPERATURE, T
A
( C)
Figure 20. Output Current Derating for the Open
Frame EBVW017A0S14R0 in the Transverse
Orientation; Airflow Direction from Vin(-) to Vin(+);
Vin = 48V.
O
U
TPUT CUR
RE
N
T,
I O
(A)
LOCAL AMBIENT TEMPERATURE, T
A
( C)
Figure 22. Output Current Derating for the Base
Plate EBVW017A0S14R0xx-H and 0.25” heat sink
in the Transverse Orientation; Airflow Direction
from Vin(-) to Vin(+); Vin = 48V.
The output power of the module should not exceed the
rated power for the module as listed in the Ordering
Information table.
Although the maximum temperature of the power modules
is TH
x
, you can limit this temperature to a lower value for
extremely high reliability.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-Mounted
Power Modules” for a detailed discussion of thermal
aspects including maximum device temperatures.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. The thermal derating of figures 20
through 22 show the maximum output current that can be
delivered by each module in the indicated orientation
without exceeding the maximum TH
x
temperature versus
local ambient temperature (T
A
) for air flows of, Natural
Convection, 1 m/s (200 ft./min), 2 m/s (400 ft./min).
Layout Considerations
The EBVW020 power module series are low profile in order
to be used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited. Avoid placing
copper areas on the outer layer directly underneath the
power module. Also avoid placing via interconnects
underneath the power module.
For additional layout guide-lines, refer to FLT007A0Z Data
Sheet.
OU
TPUT CU
RRE
N
T
, I
O
(A
)
LOCAL AMBIENT TEMPERATURE, T
A
( C)
Figure 21. Output Current Derating for the Base Plate
EBVW017A0S14R0xx-H in the Transverse
Orientation; Airflow Direction from Vin(-) to Vin(+);
Vin = 48V.