Thermal considerations, Continued) – GE Industrial Solutions ESTW010A0A Series User Manual

Page 10

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Data Sheet

November 29, 2011

ESTW010A0A Series Eighth-Brick Power Modules

36

–75Vdc Input; 5.0Vdc Output; 10A Output Current

LINEAGE

POWER

10

Thermal Considerations

(continued)

OU

TP

U

T

C

U

R

R

E

N

T

,

I

O

(

A

)

AMBIENT TEMEPERATURE, T

A

(

o

C

)

Figure 18. Output Current Derating for the Module
with Heatplate with Heatplate

and 0.50” Heatsink;

Airflow in the Transverse Direction from Vout(+) to
Vout(-); Vin =48V.


Heat Transfer via Conduction

The module can also be used in a sealed environment
with cooling via conduction from the

module’s top

surface through a gap pad material to a cold wall, as
shown in Figure 19. This capability is achieved by
insuring the top side component skyline profile
achieves no more than 1mm height difference
between the tallest and the shortest power train part
that benefits from contact with the gap pad material.
The output current derating versus cold wall
temperature, when using a gap pad such as Bergquist
GP2500S20, is shown in Figure 20.

Figure 19. Cold Wall Mounting

OU

TP

U

T

C

U

R

R

E

N

T

,

I

O

(

A

)

COLDPLATE TEMEPERATURE, T

C

(

o

C)

Figure 20. Derated Output Current versus Cold
Wall Temperature with local ambient temperature
around module at 85C; Vin=48V.

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