GE Industrial Solutions ESTW010A0A Series - Manual (Page 11)

Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36
–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 11
Surface Mount Information
Pick and Place
The modules use an open frame construction and are
designed for a fully automated assembly process.
The modules are fitted with a label designed to
provide a large surface area for pick and place
operations. The label meets all the requirements for
surface mount processing, as well as safety
standards, and is able to withstand reflow
temperatures of up to 300
o
C. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 21. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
The power modules are lead free modules and can be
soldered either in a lead-free solder process or in a
conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly. The following
instructions must be observed when soldering these
units. Failure to observe these instructions may result
in the failure of or cause damage to the modules, and
can adversely affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235
o
C. Typically, the eutectic solder melts at 183
o
C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
RE
F
L
O
W
T
E
M
P
(
C)
REFLOW TIME (S)
Figure 22. Reflow Profile for Tin/Lead (Sn/Pb)
process.
M
A
X
T
E
M
P
S
O
L
DE
R (
C)
Figure 23. Time Limit Curve Above 205
o
C for
Tin/Lead (Sn/Pb) process
Lead Free Soldering
The –Z version of the modules are lead-free (Pb-free)
and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
Reflow Soldering Information
The surface mountable modules in the family use our
newest SMT technology called “Column Pin” (CP)
connectors. Figure 24 shows the new CP connector
before and after reflow soldering onto the end-board
assembly.