GE Industrial Solutions EVW020A0A Series (Eighth-Brick) - Manual (Page 12)

Data Sheet
September 7, 2012
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
LINEAGE POWER 12
Surface Mount Information (continued)
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
R
efl
o
w
T
em
p
(°
C
)
He ating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure 24. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3
C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210
C. For Pb solder, the recommended pot
temperature is 260 C, while the Pb-free solder pot is
270 C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.