GE Industrial Solutions EHHD015A0A Hammerhead Series - Manual (Page 12)

GE Data Sheet
EHHD015A0A Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 12
Surface Mount Information (continued)
Tin Lead Soldering
The EHHD015A0A power modules are lead free modules
and can be soldered either in a lead-free solder process or
in a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions must
be observed when soldering these units. Failure to observe
these instructions may result in the failure of or cause
damage to the modules, and can adversely affect long-term
reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235oC.
Typically, the eutectic solder melts at 183oC, wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection
to ensure a reliablesolder joint. There are several types of
SMT reflow technologies currently used in the industry.
These surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For reliable
soldering the solder reflow profile should be established by
accurately measuring the modules CP connector
temperatures.
Lead Free Soldering
The –Z version of the EHHD015A0A modules are lead-free
(Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions below
may result in the failure of or cause damage to the modules
and can adversely affect long-term reliability.
RE
FL
O
W
T
EM
P (
C)
REFLOW TIME (S)
Figure 26. Reflow Profile for Tin/Lead (Sn/Pb) process.
MAX T
EMP
SOLDE
R (
C)
Figure 27. Time Limit Curve Above 205 o C for Tin/Lead
(Sn/Pb) process
Pb-free Reflow Profile
Power Systems will comply with J-STD-015 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow
profile based on the volume and thickness of the package
(table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu
(SAC). The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 28.
Figure 28. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures, refer
to GE Board
Mounted Power Modules: Soldering and Cleaning Application
Note (AN04-001).
0
50
100
150
200
250
300
P reheat zo ne
max 4
o Cs -1
Soak zone
30-240s
Heat zo ne
max 4
o Cs -1
P eak Temp 235 o C
Co oling
zone
1-4
o Cs -1
T
lim
above
205 o C
200
205
210
215
220
225
230
235
240
0 10 20 30 40 50 60
Pe r J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Re
fl
o
w
T
em
p
(
°C)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Se conds
*Time Above 217°C
60 Seconds
Cooling
Zone