GE Industrial Solutions GigaTLynx - Manual (Page 13)

Data Sheet
September 7, 2011 GigaTLynx TM SMT Non-isolated Power Modules:
4.5 – 14Vdc input; 0.7Vdc to 2.0Vdc, 50A Output
LINEAGE POWER
13
Thermal Considerations
Power modules operate in a variety of thermal
environments; however, sufficient cooling should always
be provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The thermal
data presented here is based on physical measurements
taken in a wind tunnel. The test set-up is shown in Figure
29. Note that the airflow is parallel to the short axis of the
module as shown in Figure 30. The derating data applies
to airflow in either direction of the module’s short axis.
The thermal reference points, T
ref
used in the
specifications is shown in Figure 30. For reliable
operation the temperatures at this point should not
exceed 125
o C. The output power of the module should
not exceed the rated power of the module (Vo,set x
Io,max).
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device temperatures.
Figure 30. Preferred airflow direction and location of
hot-spot of the module (Tref).
Figure 29. Thermal Test Setup.
Air
flow
x
Power Module
Wind Tunnel
PWBs
12.7_
(0.50)
76.2_
(3.0)
Probe Location
for measuring
airflow and
ambient
temperature
25.4_
(1.0)