GE Industrial Solutions GigaTLynx - Manual (Page 19)

Data Sheet
September 7, 2011 GigaTLynx TM SMT Non-isolated Power Modules:
4.5 – 14Vdc input; 0.7Vdc to 2.0Vdc, 50A Output
LINEAGE POWER 19
Surface Mount Information
Pick and Place
The Giga TLynx TM SMT modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
o C. The label also carries
product information such as product code, serial
number and location of manufacture.
Figure 31. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and pick &
placement speed should be considered to optimize
this process. The minimum recommended inside
nozzle diameter for reliable operation is 3mm. The
maximum nozzle outer diameter, which will safely fit
within the allowable component spacing, is 5 mm
max.
Bottom Side Assembly
This module is not recommended for assembly
on the bottom side of a customer board. If such
an assembly is attempted, components may fall
off the module during the second reflow process.
If assembly on the bottom side is planned, please
contact Lineage Power for special manufacturing
process instructions.
Lead-free (Pb-free) Soldering
The –Z version Giga TLynx modules are lead-free
(Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and
a SnPb soldering process
. Failure to observe the
instructions below may result in the failure of or
cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices)
for both Pb-free solder profiles and MSL
classification procedures. This standard provides
a recommended forced-air-convection reflow
profile based on the volume and thickness of the
package (table 5-2). The suggested Pb-free solder
paste is Sn/Ag/Cu (SAC).
Recommended linear reflow profile using Sn/Ag/Cu
solder:
NOTE: Soldering outside of the recommended
profile requires testing to verify results and
performance.
Tin Lead Soldering
The Giga TLynx TM SMT power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.