GE Industrial Solutions ESTW006A0B Series - Manual (Page 10)

Data Sheet
November 5, 2012 ESTW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6A
dc
Output
LINEAGE POWER 10
Surface Mount Information
MSL Rating
The ESTW006A0B-SZ module has a MSL rating of
2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are provided for the
ESTW006A0Bxx-SZ modules. These sealed
packages should not be broken until time of use.
Once the original package is broken, the floor life of
the product at conditions of
 30°C and 60% relative
humidity varies according to the MSL rating (see J-
STD-033A). The shelf life for dry packed SMT
packages is a minimum of 12 months from the bag
seal date, when stored at the following conditions: <
40° C, < 90% relative humidity
.
Pick and Place
The ESTW006A0Bxx-S modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
o C. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 21. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Reflow Soldering Information
The surface mountable modules in the
ESTW006A0Bxx-S family use our newest SMT
technology called “Column Pin” (CP) connectors.
Figure 22 shows the new CP connector before and
after reflow soldering onto the end-board assembly.
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag
3
/Cu
(SAC) solder for –Z codes.
EHHD Board
Insulator
Solder Ball
End assembly PCB
Figure 22. Column Pin Connector Before and After
Reflow Soldering.
The CP connector design is able to compensate for
large amounts of planarity and still ensure a reliable
SMT solder joint. Typically, the eutectic solder melts
at 363°C (Sn/Pb solder) or 217-236°C (SAC solder),
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. The
following instructions must be observed when SMT
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
Tin Lead Soldering
The ESTW006A0Bxx-S power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process,
peak reflow temperatures are limited to less than
235°C. Typically, the eutectic solder melts at 363°C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For