GE Industrial Solutions 12V Austin MicroLynx 5A - Manual (Page 19)

GE
Data Sheet
12V Austin MicroLynx TM 5A: Non-Isolated DC-DC Power Modules
10Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 5A Output Current
May 6, 2013 ©2013 General Electric Company. All rights reserved. Page 19
Surface Mount Information
Pick and Place
The Austin MicroLynx TM 12V SMT modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and
placing. The label meets all the requirements for surface
mount processing, as well as safety standards and is able to
withstand maximum reflow temperature. The label also
carries product information such as product code, serial
number and location of manufacture.
Figure 33. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style, vacuum
pressure and pick & placement speed should be considered
to optimize this process. The minimum recommended
nozzle diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the
allowable component spacing, is 8 mm max.
Tin Lead Soldering
The Austin MicroLynx TM 12V SMT power modules are lead
free modules and can be soldered either in a lead-free solder
process or in a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in order
to customize the solder reflow profile for each application
board assembly. The following instructions must be
observed when soldering these units. Failure to observe
these instructions may result in the failure of or cause
damage to the modules, and can adversely affect long-term
reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235
o C. Typically,
the eutectic solder melts at 183 o C, wets the land, and
subsequently wicks the device connection. Sufficient time
must be allowed to fuse the plating on the connection to
ensure a reliable solder joint. There are several types of SMT
reflow technologies currently used in the industry. These
surface mount power modules can be reliably soldered using
natural forced convection, IR (radiant infrared), or a
combination of convection/IR. For reliable soldering the
solder reflow profile should be established by accurately
measuring the modules CP connector temperatures.
REFL
O
W
TE
MP
(°
C)
0
50
100
150
200
250
300
Preheat zo ne
max 4
o Cs -1
So ak zo ne
30-240s
Heat zo ne
max 4
o Cs -1
Peak Temp 235 o C
Coo ling
zone
1-4
o Cs -1
T
lim
above
205 o C
REFLOW TIME (S)
Figure 34. Reflow Profile for Tin/Lead (Sn/Pb) process.
M
AX
TE
MP SO
LDER (
°C)
200
205
210
215
220
225
230
235
240
0 10 20 30 40 50 60
Figure 35. Time Limit Curve Above 205 o C for Tin/Lead
(Sn/Pb) process.