GE Industrial Solutions 12V Austin MicroLynx 5A - Manual (Page 20)

GE
Data Sheet
12V Austin MicroLynx TM 5A: Non-Isolated DC-DC Power Modules
10Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 5A Output Current
May 6, 2013 ©2013 General Electric Company. All rights reserved. Page 20
Surface Mount Information (continued)
Lead Free Soldering
The –Z version Austin MicroLynx 12V SMT modules are lead-
free (Pb-free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering
process. Failure to observe the instructions below may result
in the failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow
profile based on the volume and thickness of the package
(table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu
(SAC). The recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Fig. 36.
MSL Rating
The Austin MicroLynx 12V SMT modules have a MSL rating of
2a..
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are required for
MSL ratings of 2 or greater. These sealed packages should
not be broken until time of use. Once the original package is
broken, the floor life of the product at conditions of
≤ 30°C
and 60% relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT packages
will be a minimum of 12 months from the bag seal date,
when stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Board
Mounted Power Modules: Soldering and Cleaning Application
Note (AN04-001).
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
R
efl
ow
T
em
p
(°
C
)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure 36. Recommended linear reflow profile using
Sn/Ag/Cu solder.