GE Industrial Solutions Austin SuperLynx SMT - Manual (Page 19)

Data Sheet
September 3, 2013 Austin Superlynx TM SMT Non-isolated Power Modules:
3.0 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 16A output current
LINEAGE POWER 19
Surface Mount Information
Pick and Place
The Austin SuperLynx TM SMT modules use an open
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
o C. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 35. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Reflow Soldering Information
The Austin SuperLynx TM SMT power modules are
large mass, low thermal resistance devices and
typically heat up slower than other SMT components.
It is recommended that the customer review data
sheets in order to customize the solder reflow profile
for each application board assembly. The following
instructions must be observed when soldering these
units. Failure to observe these instructions may result
in the failure of or cause damage to the modules, and
can adversely affect long-term reliability.
Typically, the eutectic solder melts at 183 o C, wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on
the connection to ensure a reliable solder joint. There
are several types of SMT reflow technologies
currently used in the industry. These surface mount
power modules can be reliably soldered using natural
forced convection, IR (radiant infrared), or a
combination of convection/IR. For reliable soldering
the solder reflow profile should be established by
accurately measuring the modules pin temperatures.
Figure 36. Reflow Profile.
An example of a reflow profile (using 63/37 solder) for
the Austin SuperLynx
TM SMT power module is :
• Pre-heating zone: room temperature to 183 o C
(2.0 to 4.0 minutes maximum)
• Initial ramp rate < 2.5 o C per second
• Soaking Zone: 155 o C to 183 o C – 60 to 90
seconds typical (2.0 minutes maximum)
• Reflow zone ramp rate:1.3 o C to 1.6 o C per second
• Reflow zone: 210 o C to 235 o C peak temperature –
30 to 60 seconds (90 seconds maximum