GE Industrial Solutions SHHN000A3 HAMMERHEAD Series - Manual (Page 10)

GE
Datasheet
SHHN000A3 Series; DC-DC Converter Power Modules
9Vdc – 36Vdc input; +15V, -15V Dual Output, 0.3A 9W Output
December 6, 2013
©2013 General Electric Corporation.
All rights reserved.
Page 10
Layout Considerations
The SHHN000A3 power module series are low profile in order
to be used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited. Avoid placing
copper areas on the outer layer directly underneath the power
module. Also avoid placing via interconnects underneath the
power module.
The SHHN000A3 family of power modules is available for
either Through-Hole (TH) or Surface Mount (SMT) soldering.
Through-Hole Soldering Information
The RoHS-compliant (Z codes) through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed through
single or dual wave soldering machines. The pins have an
RoHS-compliant finish that is compatible with both Pb and Pb-
free wave soldering processes. A maximum preheat rate of
3
°C/s is suggested. The wave preheat process should be such
that the temperature of the power module board is kept below
210
°C. For Pb solder, the recommended pot temperature is
260 °C, while the Pb-free solder pot is 270°C max. The Through
Hole module is also compatible with paste-in-hole reflow
soldering. Refer to the Reflow Soldering Information section for
process details. If additional information is needed, please
consult with your GE representative for more details.
Surface Mount Information
Pick and Place
The SHHN-SR series of DC-to-DC power converters use an
open-frame construction and are designed for surface mount
assembly within a fully automated manufacturing process.
The SHHN-SR series modules are designed to use the main
magnetic component surface to allow for pick and place.
Note: All dimensions in mm [in].
Figure 19. Pick and Place Location.
Z Plane Height
The ‘Z’ plane height of the pick and place location is 7.50mm
nominal with an RSS tolerance of +/-0.25 mm.
Nozzle Recommendations
The module weight has been kept to a minimum by using open
frame construction. Even so, they have a relatively large mass
when compared with conventional SMT components.
Variables such as nozzle size, tip style, vacuum pressure and
placement speed should be considered to optimize this
process.
The minimum recommended nozzle diameter for reliable
operation is 5mm. The maximum nozzle outer diameter, which
will safely fit within the allowable component spacing, is
6.5mm.
Oblong or oval nozzles up to 11 x 6 mm may also be used
within the space available.
For further information please contact your local GE Technical
Sales Representative.
Reflow Soldering Information
These power modules are large mass, low thermal
resistance devices and typically heat up slower than other
SMT components. It is recommended that the customer
review data sheets in order to customize the solder reflow
profile for each application board assembly.
The following instructions must be observed when SMT
soldering these units. Failure to observe these instructions
may result in the failure of or cause damage to the modules,
and can adversely affect long-term reliability.
There are several types of SMT reflow technologies currently
used in the industry. These surface mount power modules
can be reliably soldered using natural forced convection, IR
(radiant infrared), or a combination of convection/IR. The
recommended linear reflow profile using Sn/Pb solder is
shown in Figure 19 and 20. For reliable soldering the solder
reflow profile should be established by accurately
measuring the module’s pin connector temperatures.
REF
LOW T
EMP
(°
C)
REFLOW TIME (S)
Figure 20. Recommended Reflow Profile for Sn/Pb solder.
15.2
[.60]
14.5
[.57]
0
50
100
150
200
250
300
P reheat zo ne
max 4
o Cs -1
So ak zo ne
30-240s
Heat zo ne
max 4
o Cs -1
P eak Temp 235 o C
Co o ling
zo ne
1-4
o Cs -1
T
lim
above
205 o C