GE Industrial Solutions QPW050-060 Series - Manual (Page 20)

Data Sheet
February 2, 2011
QPW050/060 Series Power Modules; DC-DC converters
36-75Vdc Input; 1.2Vdc to 3.3Vdc Output
LINEAGE POWER 20
Layout Considerations
The QPW power module series are low profile in
order to be used in fine pitch system card
architectures. As such, component clearance
between the bottom of the power module and the
mounting board is limited. Avoid placing copper areas
on the outer layer directly underneath the power
module. Also avoid placing via interconnects
underneath the power module.
For additional layout guide-lines, refer to
FLTR100V10 data sheet.
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3
C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210
C. For Pb solder, the recommended pot
temperature is 260 C, while the Pb-free solder pot is
270 C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.