GE Industrial Solutions HW-HC004-005-006 Series - Manual (Page 24)

Data Sheet
October 4, 2013
HW/HC004/005/006 Series DC-DC Power Module:
18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
LINEAGE POWER 24
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3
°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210
°C. For Pb solder, the recommended pot
temperature is 260
°C, while the Pb-free solder pot is
270
°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
Surface Mount Information
Packaging Details
The surface mount versions of the HW005 family
(suffix –S) are supplied as standard in the plastic tray
shown in Figure 69. The tray has external
dimensions of 135.1mm (W) x 321.8mm (L) x 12.4mm
(H) or 5.319in (W) x 12.669in (L) x 0.489in (H).
Surface mount versions of the HW005 family are also
available as an option packaged in Tape and Reel.
For further information on this please contact your
local Lineage Power Technical Sales Representative.
Figure 69. Surface Mount Packaging Tray
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 10
12 Ω/sq
Color Clear
Capacity 15 power modules
Min order quantity 60 pcs (1 box of 4 full
trays)
Each tray contains a total of 15 power modules. The
trays are self-stacking and each shipping box will
contain 4 full trays plus one empty hold down tray
giving a total number of 60 power modules.
Pick and Place
The HW005-S series of DC-to-DC power converters
use an open-frame construction and are designed for
surface mount assembly within a fully automated
manufacturing process.
The HW005-S series modules are fitted with a Kapton
label designed to provide a large flat surface for pick
and placing. The label is located covering the Centre
of Gravity of the power module. The label meets all
the requirements for surface-mount processing, as
well as meeting UL safety agency standards. The
label will withstand reflow temperatures up to 300
°C.
The label also carries product information such as
product code, date and location of manufacture.