Kbvw006a0b series sixteenth-brick power modules, Data sheet – GE Industrial Solutions KBVW006A0B Series User Manual

Page 9

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GE

Data Sheet

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

July 9, 2013

©2012 General Electric Company. All rights reserved.

Page 9


Figure 13. T

ref

Temperature Measurement Location

for Open frame Module.


The thermal reference point, T

ref

,

used in the

specifications for modules with heatplate is shown in

Figure 14. For reliable operation this temperature should
not exceed 110

o

C.

Figure 14. T

ref

Temperature Measurement Location

for Module with Heatplate.

Heat Transfer via Convection

Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the

maximum output current that can be delivered by
each module versus local ambient temperature (T

A

)

for natural convection and up to 2m/s (400 LFM) forced

airflow are shown in Figures 15 & 16a.

Please refer to the Application Note “Thermal

Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.




OUT

PUT

CURR

EN

T,

I

O

(A

)

AMBIENT TEMEPERATURE, T

A

(

o

C

)

Figure 15. Output Current Derating for the Open

Frame Module; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.

OUT

PUT

C

U

RR

EN

T, I

O

(A)

AMBIENT TEMEPERATURE, T

A

(

o

C

)

Figure 16a. Output Current Derating for the Module
with Heatplate; Airflow in the Transverse Direction

from Vout(+) to Vout(-); Vin =48V.

Heat Sink Attachment

The heatplate used on the module does not have tapped
holes for heat sink attachment. A heat sink can be

attached using adhesives made for this purpose. When
curing these types of adhesives, do not exceed the
maximum storage temperature of 125

o

C.

Heat Transfer via Conduction

Modules with heat plate option (-H) can also be used in
cold wall applications for heat transfer via conduction
cooling. Fig 16b shows the derating curve for this

application.

OUTPUT CURRENT

, I

O

(A

)

COLDPLATE TEMEPERATURE, T

A

(

o

C

)

Figure 16b. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction

from Vout(+) to Vout(-); Vin =48V.

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