Diodes DMN2005UFG - Manual (Page 2)

POWERDI is a registered trademark of Diodes Incorporated
.
DMN2005UFG
Document number: DS36943 Rev. 2 - 2
2 of 7
www.diodes.com
May 2014
© Diodes Incorporated
DMN2005UFG
ADVAN
CE I
N
F
O
RM
ATI
O
N
ADVANCED INFORMATION
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage V
DSS
20 V
Gate-Source Voltage V
GSS
±12 V
Continuous Drain Current (Note 6) V
GS
= 4.5V
Steady
State
T
C
= +25°C
T
C
= +70°C
I
D
18.1
14.5
A
t<10s
T
A
= +25°C
T
A
= +70°C
I
D
24.1
19.3
A
Pulsed Drain Current (10µs pulse, duty cycle = 1%) I
DM
58.3 A
Maximum Continuous Body Diode Forward Current (Note 6) I
S
2.6 A
Avalanche Current , L = 0.2mH I
AS
23.9 A
Repetitive Avalanche Energy, L = 0.2mH E
AS
58.4 mJ
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) T
A
= +25°C P
D
1.05 W
Thermal Resistance, Junction to Ambient (Note 5)
Steady state
R
θJA
120
°C/W
t<10s 67
Total Power Dissipation (Note 6) T
A
= +25°C P
D
2.27 W
Thermal Resistance, Junction to Ambient (Note 6)
Steady state
R
θJA
55
°C/W t<10s 31
Thermal Resistance, Junction to Case (Note 6) R
θJC
6.1
Operating and Storage Temperature Range T
J,
T
STG
-55 to +150 °C
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate