Rs-232 craft interface, 10/100base-t ethernet interface, Discrete alarms – ADC ACE-COM L1 User Manual

Page 14: Rs-232 c

Advertising
background image

External Interfaces

LTPH-UM-1088-02, Issue 2

4

January 3, 2002

ThinMux Chassis

RS-232 C

RAFT

I

NTERFACE

Communication with the ThinMux STS-1 and ThinMux DS3 central
processors occur through a standard grounded DB-9 connector (RS-232 Data
Communication Equipment interface).

Signals are routed to both multiplexers, and the transmitter of the inactive
multiplexer remains in a tristate mode. Pin 5 is the digital ground of all digital
components (both multiplexers). See

Table 3 on page 17

for interface pinout

description.

10/100BASE-T E

THERNET

I

NTERFACE

Communication with the multiplexer (STS-1 or DS3) central processors
occurs through the standard grounded RJ-45 10/100BASE-T interface for
metallic chassis. Similar to the RS-232 interface, signals are routed to both
multiplexers; the transmitter of the inactive multiplexer remains in a tristate
mode. See

Table 4 on page 17

for interface pinout description.

D

ISCRETE

A

LARMS

In addition to the various interfaces supplied by the ThinMux chassis, the
common access panel (see

Figure 4 on page 8

) provides access for discrete

alarm wiring.

The discrete alarms connection is provided by 0.045-inch wire-wrap pins
located on the rear of the chassis (see

Figure 1 on page 2

). The signals are

routed to the multiplexers, where the logic functions are performed. Critical
VIS and AUD alarms comprise dry contacts for telemetry applications. The
alarms have an independent common connection (serial COM port) to relays;
normally open (NO) is provided. Current is limited to 0.5A when a maximum
temperature rise of 20°C on traces is desired (as per MIL-STD-275C).

When using a legacy HXU-358 multiplexer, the CRIT VIS, CRIT AUD, and
Alarm pins must be left unconnected. For all other multiplexers, these pins
may be used as needed.

Other alarms (FE, MIN, MAJ, and CRIT) share the same COM, and only
normally open contact is provided as shown in

Figure 4 on page 8

. Contact

closure is made using a solid-state relay photo Metal-Oxide Semiconductor

Advertising