IEI Integration ICE-DB-9S - Manual (Page 117)

ICE Module
Page 104
Carrier Board topside components within the module envelope shall be limited to a
height of 4 mm (dimension ‘C’ in Figure 6-11), with the exception of the mating
connectors. Using Carrier Board topside components up to 4mm allows a gap of 0.2
mm between Carrier Board topside components and module bottom side components.
This may not be sufficient in some situations. In Carrier Board applications in which
vibration or board flex is a concern, then the Carrier Board component height should
be restricted to a value less than 4 mm that yields a clearance that is sufficient for the
application.
Figure 6-10: Component Clearances Underneath Module