4 thermal specifications, Thermal specifications – Kontron MSM800SEL User Manual
Page 79
MSM800SEV/SEL
/ Design Considerations
www.kontron.com
77
8.4 Thermal Specifications
The temperature is specified by 90°C for the BGA case. The table shows the allowable ambient temperature at various
airflows and with different heat sink configurations.
CPU: LX800 / T (case) = 90°C / Power consumption: 5W
Photo of heat sink
H
ea
t
si
n
k
ty
p
e
Pa
rt
N
r.
Pr
o
d
uc
t
M
SM
8
0
0…
CP
U
Fr
eq
ue
n
cy
[M
H
z]
A
ir
T
em
p
er
at
u
re
(a
m
b
ie
n
t)
T
ca
se
:
N
o
A
ir
fl
o
w
0
m
/s
ec
T
ca
se
:
A
ir
fl
o
w
3
m
/s
ec
T
ca
se
:
A
ir
fl
o
w
6
m
/s
ec
No
heat sink
All
MSM800s
500
60°C
90°C
Small
807041
All
MSM800s
500
70°C
100°C
90°C
80°C
BEV
500
85°C
Large
807042
XEV
XEL
500
85°C
BEV
500
85°C
-
-
-
Thermo-
junction
807043
(see Notes
below)
XEV
XEL
500
85°C
-
-
-
Two PC104 mounting holes are used for the large cooler.
The thermojunction has been specifically designed by KCC to have 2 almost separate parts to provide distinct
heat dissipation for the CPU and the other onboard chips. The holes in the thermojunction are for ø2mm screws. The
holes in the casing/housing that will be attached to the thermojunction should be ø2.5 or 3mm.