Block diagram, Architecture description, Block diagram architecture description – Sundance SMT376 User Manual

Page 7: Fpga controller

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Version 1.7

Page 7 of 24

SMT376 User Manual

Block Diagram

83 I/O

2

x Comm-

Po

rt

s/

SDL

24

I/

O

p

ins

T

im

er,& C

ont

ro

l

15

I/

O

p

ins

2x Comm-

Po

rt/SDL

24

I/

O p

ins

G

lob

al

Bus

74

I/

O p

ins

JTAG Header

J1 Top Primary TIM

Connector

Comm-Port 0 & 3

J3 Global Expansion

Connector

J2 Bottom Primary TIM

Connector

Comm-Port 1 & 4

(2 linked with 5)

Linear regulators for

CPU & FPGA cores

Sundance High-speed Bus

(60-way Samtec)

Sundance Digital Bus

(40-way ODU)

4 LEDs &

4 I/O pins

256M bytes SDRAM (CE2,3)

8 x K4S560832

(32M x 8)

Flash (CE1)

Start-up mode selection.

64 pins

McBSP &

GPIO

Header

McBSP

'C6711/6713

DSP

FPGA Controller

Spartan-IIE, FG456

329 I/O Pins

XC2S300E

1.5V

TTL I/O

Architecture Description


The SMT376 TIM consists of a Texas Instruments TMS320C6211/6711/6713 running
at up to 225MHz. Modules are populated with 256MBytes of synchronous DRAM
(SDRAM).
A Field Programmable Gate Array (FPGA) is used to manage global bus accesses
and implement four communication ports and Sundance Digital/High-speed Buses.
This is a Xilinx Spartan –IIE device.

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