Chapter 4, Chapter 4: hardware setup, Introduction – Lanner LEC-3013 User Manual

Page 19: Preparing the hardware installation

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19

Introduction

Chapter 4

Embedded and Industrial Computing

Installing the System Memory

The motherboard supports DDR3 memory that features

data transfer rates of 1066/1333 MHz to meet the higher

bandwidth requirements of the latest operating system

and Internet applications. It comes with one Double Data

Rate 3 (DDR3) Small Outline Dual Inline Memory Module

(SO-DIMM) socket.

Align the memory module’s key with the SO-DIMM

1.

socket’s key.
Install the SO-DIMM.

2.

Chapter 4:

Hardware Setup

Preparing the Hardware Installation

To access some components and perform certain service

procedures, you must perform the following procedures

first.

WARNING: To reduce the risk of personal injury,

electric shock, or damage to the equipment,

remove the power cord to remove power from

the server. Portions of the power supply and some

internal circuitry remain active until power is

removed.

Unpower the LEC-3013 and remove the power cord.

1.

The top cover has an L shape. Unscrew the 2 threaded

2.

screws at the top of the front panel and the 2 screws at

the bottom of the opposite side. Also unscrew the two

knots to loose the VGA port.
Slide the cover backwards to open the top cover.

3.

Unscrew 4 screws from each side of the LEC-3013

4.

System and take off the side panel.

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