Intel® Integrated RAID Module SROMBSASMR (AXXROMBSASMR) Technical Product Specification
Table of Contents
1.
Introduction .......................................................................................................................... 1
1.1
Product Overview .................................................................................................... 1
1.2
Operating System Support ...................................................................................... 1
1.3
Features List ............................................................................................................ 2
2.
Hardware ............................................................................................................................... 4
2.1
Block Diagram ......................................................................................................... 4
2.2
Module Layout ......................................................................................................... 5
2.3
Major Components .................................................................................................. 5
2.3.1
LSI* 1078 SAS ROC................................................................................................ 5
2.3.2
Flash ROM............................................................................................................... 6
2.3.3
Boot Strap ROM (SEEPROM) ................................................................................. 6
2.3.4
NVSRAM ................................................................................................................. 6
2.3.5
SDRAM (Cache) ...................................................................................................... 6
2.3.6
Diagnostics .............................................................................................................. 7
2.3.7
SAS / SATA Connectors.......................................................................................... 7
2.3.8
Host Board Interface................................................................................................ 8
2.3.9
BBU Interface ........................................................................................................ 10
2.3.10
Jumpers and Connectors....................................................................................... 12
2.4
Hardware Architectural Features ........................................................................... 12
2.5
Electrical Characteristics ....................................................................................... 13
2.6
Environmental Specifications................................................................................. 13
2.7
Supported Device Technology............................................................................... 14
2.7.1
Support for Hard Disk Drive Devices ..................................................................... 14
2.7.2
SAS Expander Support.......................................................................................... 14
2.7.3
Support for Non-Hard Disk Drive Devices ............................................................. 14
2.7.4
Enclosure Management Support ........................................................................... 14
3.
Software .............................................................................................................................. 15
3.1
Common Layers .................................................................................................... 16
3.1.1
Firmware................................................................................................................ 16
3.1.2
API ......................................................................................................................... 16
3.1.3
Operating System Driver ....................................................................................... 17
Revision 1.2
Intel order number E59029-003
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