Intel 5400 Series User Manual
Quad-core intel, Xeon, Processor 5400 series
Advertising
Table of contents
Document Outline
- 1 Introduction
- 2 Thermal/Mechanical Reference Design
- 2.1 Mechanical Requirements
- 2.2 Processor Thermal Parameters and Features
- 2.2.1 Thermal Control Circuit and TDP
- 2.2.2 Digital Thermal Sensor
- 2.2.3 Platform Environmental Control Interface (PECI)
- 2.2.4 Multiple Core Special Considerations
- 2.2.5 Thermal Profile
- 2.2.6 TCONTROL Definition
- 2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5400 Series
- 2.2.8 Performance Targets
- 2.3 Fan Fail Guidelines
- 2.4 Characterizing Cooling Solution Performance Requirements
- 2.5 Thermal/Mechanical Reference Design Considerations
- 2.5.1 Heatsink Solutions
- 2.5.2 Thermal Interface Material
- 2.5.3 Summary
- 2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design
- 2.5.5 Thermal Solution Performance Characteristics
- 2.5.6 Thermal Profile Adherence
- 2.5.7 Components Overview
- 2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile
- A 1U Alternative Heatsink Thermal/Mechanical Design
- B Mechanical Drawings
- C Heatsink Clip Load Methodology
- D Safety Requirements
- E Quality and Reliability Requirements
- F Enabled Suppliers Information