Samsung 1H 2011 - Manual (Page 15)

samsung.com/semi/flash 15 1H 2011
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Flash Ordering Information
1. Memory (K)
2. NAND Flash : 9
3. Small Classification
(sLC : single Level Cell, MLC : Multi Level Cell)
7 : sLC moviNAND
8 : MLC moviNAND
F : sLC Normal
G : MLC Normal
H : MLC QDP
K : sLC DDP
L : MLC DDP
M : MLC DsP
N : sLC DsP
P : MLC 8 Die stack
Q : sLC 8 Die stack
s : sLC single sM
t : sLC sINGLe (s/B)
U : 2 stack MsP
W : sLC 4 Die stack
4~5. Density
12 : 512M
56 : 256M
1G : 1G
2G : 2G
4G : 4G
8G : 8G
AG : 16G BG :
32G CG : 64G
DG : 128G
eG : 256G
LG : 24G
NG : 96G
ZG : 48G
00 : NoNe
6~7. Organization
00 : NoNe
08 : x8
16 : x16
8. Vcc
A : 1.65V~3.6V B : 2.7V (2.5V~2.9V)
C : 5.0V (4.5V~5.5V) D : 2.65V (2.4V~2.9V)
e : 2.3V~3.6V R : 1.8V (1.65V~1.95V)
Q : 1.8V (1.7V~1.95V) t : 2.4V~3.0V
U : 2.7V~3.6V V : 3.3V (3.0V~3.6V)
W : 2.7V~5.5V, 3.0V~5.5V 0 : NoNe
9. Mode
0 : Normal
1 : Dual nCe & Dual R/nB
3 : tri /Ce & tri R/B
4 : Quad nCe & single R/nB
5 : Quad nCe & Quad R/nB
9 : 1st block otP
A : Mask option 1
L : Low grade
10. Generation
M : 1st Generation
A : 2nd Generation
B : 3rd Generation
C : 4th Generation
D : 5th Generation
11. “ ----”
12. Package
A : CoB
B : FBGA (Halogen-Free, Lead-Free)
C : CHIP BIZ D : 63-tBGA
F : WsoP (Lead-Free) G : FBGA
H : tBGA (Lead-Free)
I : ULGA (Lead-Free) (12*17)
J : FBGA (Lead-Free)
L : ULGA (Lead-Free) (14*18)
M : tLGA N : tLGA2
P : tsoP1 (Lead-Free)
Q : tsoP2 (Lead-Free)
s : tsoP1 (Halogen-Free, Lead-Free)
t : tsoP2 U : CoB (MMC)
V : WsoP W : Wafer
Y : tsoP1 Z : WeLP (Lead-Free)
13. Temp
C : Commercial I : Industrial
0 : NoNe (Containing Wafer, CHIP, BIZ, exception
handling code)
14. Customer Bad Block
B : Include Bad Block
D : Daisychain sample
L : 1~5 Bad Block
N : ini. 0 blk, add. 10 blk
s : All Good Block
0 : NoNe (Containing Wafer, CHIP, BIZ, exception
handling code)
15. Pre-Program Version
0 : None
serial (1~9, A~Z)
FlASH Product orderinG inForMAtion
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
K 9 X X X X X X X X - X X X X
SAMSUNG Memory
NAND Flash
Small Classification
Density
Density
Organization
Organization
Vcc Pre-Program Version
Customer Bad Block
Temp
Package
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Generation
Mode