Package outlines – Philips TDA1519C User Manual

Page 13

Advertising
background image

2004 Jan 28

13

NXP Semiconductors

Product specification

22 W BTL or 2

 11 W

stereo power amplifier

TDA1519C

PACKAGE OUTLINES

UNIT

A

b

max.

b

p

2

c

D

(1)

E

(1)

Z

(1)

d

e

D

h

L

j

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

4.6
4.4

1.1

0.75
0.60

0.48
0.38

24.0
23.6

20.0
19.6

10

2.54

12.2
11.8

3.4
3.1

A

max.

1

2

E

h

6

2.00
1.45

2.1
1.8

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

17.2
16.5

SOT131-2

99-12-17
03-03-12

0

5

10 mm

scale

Q

0.25

w

0.03

x

D

L

A

E

c

A 2

Q

w

M

b

p

d

D

Z

e

x

h

1

9

Eh

non-concave

seating plane

1

b

j

SIL9P: plastic single in-line power package; 9 leads

SOT131-2

view B: mounting base side

B

Advertising