Philips TDA1519C - Manual (Page 2)

2004 Jan 28 2
NXP Semiconductors Product specification
22 W BTL or 2
 11 W
stereo power amplifier
TDA1519C
FEATURES
 Requires very few external components for Bridge-Tied
Load (BTL) operation
 Stereo or BTL application
 High output power
 Low offset voltage at output (important for BTL
applications)
 Fixed gain
 Good ripple rejection
 Mute/standby switch
 Load dump protection
 AC and DC short-circuit safe to ground and V
P
 Thermally protected
 Reverse polarity safe
 Capability to handle high energy on outputs (V
P
= 0 V)
 No switch-on/switch-off plops
 Protected against electrostatic discharge
 Low thermal resistance
 Identical inputs (inverting and non-inverting)
 Pin compatible with TDA1519B (TDA1519C and
TDA1519CSP).
GENERAL DESCRIPTION
The TDA1519C is an integrated class-B dual output
amplifier in a 9-lead plastic single in-line power package or
20-lead heatsink small outline package.
For the TDA1519CTH (SOT418-3), the heatsink is
positioned on top of the package, which allows an external
heatsink to be mounted on top. The heatsink of the
TDA1519CTD (SOT397-1) is facing the PCB, allowing the
heatsink to be soldered onto the copper area of the PCB.
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME DESCRIPTION VERSION
TDA1519C SIL9P plastic single in-line power package; 9 leads SOT131-2
TDA1519CSP SMS9P plastic surface mounted single in-line power package; 9 leads SOT354-1
TDA1519CTD HSOP20 plastic, heatsink small outline package; 20 leads SOT397-1
TDA1519CTH HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-3