Package outline, Silicon mmic amplifier bga2003 – Philips BGA2003 User Manual
Page 10
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2010 Sep 13
10
NXP Semiconductors
Product specification
Silicon MMIC amplifier
BGA2003
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT343R
D
A
A1
Lp
Q
detail X
c
HE
E
v
M
A
A
B
0
1
2 mm
scale
X
2
1
4
3
Plastic surface-mounted package; reverse pinning; 4 leads
SOT343R
w
M
B
97-05-21
06-03-16
bp
UNIT
A1
max
bp
c
D
E
b1
HE
Lp
Q
w
v
mm
0.1
1.1
0.8
0.4
0.3
0.25
0.10
0.7
0.5
2.2
1.8
1.35
1.15
e
2.2
2.0
1.3
e1
0.2
y
0.1
0.2
1.15
DIMENSIONS (mm are the original dimensions)
0.45
0.15
0.23
0.13
e1
A
e
y
b1
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