Package outline, Silicon mmic amplifier bga2003 – Philips BGA2003 User Manual

Page 10

Advertising
background image

2010 Sep 13

10

NXP Semiconductors

Product specification

Silicon MMIC amplifier

BGA2003

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT343R

D

A

A1

Lp

Q

detail X

c

HE

E

v

M

A

A

B

0

1

2 mm

scale

X

2

1

4

3

Plastic surface-mounted package; reverse pinning; 4 leads

SOT343R

w

M

B

97-05-21
06-03-16

bp

UNIT

A1

max

bp

c

D

E

b1

HE

Lp

Q

w

v

mm

0.1

1.1
0.8

0.4
0.3

0.25
0.10

0.7
0.5

2.2
1.8

1.35
1.15

e

2.2
2.0

1.3

e1

0.2

y

0.1

0.2

1.15

DIMENSIONS (mm are the original dimensions)

0.45
0.15

0.23
0.13

e1

A

e

y

b1

Advertising