Package outline, Tda8932b, Nxp semiconductors – NXP Semiconductors TDA8932B User Manual
Page 41: Class-d audio amplifier
TDA8932B_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 18 December 2008
41 of 48
NXP Semiconductors
TDA8932B
Class-D audio amplifier
15. Package outline
Fig 40. Package outline SOT287-1 (SO32)
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
e
H
E
L
L
p
Q
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
2.65
0.1
0.25
0.01
1.4
0.055
0.3
0.1
2.45
2.25
0.49
0.36
0.27
0.18
20.7
20.3
7.6
7.4
1.27
10.65
10.00
1.2
1.0
0.95
0.55
8
0
o
o
0.25
0.1
0.004
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT287-1
MO-119
(1)
0.012
0.004
0.096
0.089
0.02
0.01
0.05
0.047
0.039
0.419
0.394
0.30
0.29
0.81
0.80
0.011
0.007
0.037
0.022
0.01
0.01
0.043
0.016
w
M
b
p
D
H
E
Z
e
c
v
M
A
X
A
y
32
17
16
1
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
E
pin 1 index
0
5
10 mm
scale
SO32: plastic small outline package; 32 leads; body width 7.5 mm
SOT287-1
00-08-17
03-02-19