NXP Semiconductors TDA8932B - Manual (Page 48)

NXP Semiconductors
TDA8932B
Class-D audio amplifier
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 18 December 2008
Document identifier: TDA8932B_4
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
21. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Functional description . . . . . . . . . . . . . . . . . . . 5
8.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.2 Mode selection and interfacing . . . . . . . . . . . . . 6
8.3 Pulse width modulation frequency . . . . . . . . . . 7
8.4 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
8.4.1 Thermal Foldback (TF) . . . . . . . . . . . . . . . . . . . 9
8.4.2 OverTemperature Protection (OTP) . . . . . . . . . 9
8.4.3 OverCurrent Protection (OCP) . . . . . . . . . . . . . 9
8.4.4 Window Protection (WP). . . . . . . . . . . . . . . . . . 9
8.4.5 Supply voltage protection . . . . . . . . . . . . . . . . 10
8.5 Diagnostic input and output . . . . . . . . . . . . . . 11
8.6 Differential inputs . . . . . . . . . . . . . . . . . . . . . . 11
8.7 Output voltage buffers. . . . . . . . . . . . . . . . . . . 11
9 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 12
10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 16
11 Thermal characteristics. . . . . . . . . . . . . . . . . . 16
12 Static characteristics. . . . . . . . . . . . . . . . . . . . 17
13 Dynamic characteristics . . . . . . . . . . . . . . . . . 19
14 Application information. . . . . . . . . . . . . . . . . . 22
14.1 Output power estimation . . . . . . . . . . . . . . . . . 22
14.2 Output current limiting. . . . . . . . . . . . . . . . . . . 24
14.3 Speaker configuration and impedance . . . . . . 24
14.4 Single-ended capacitor . . . . . . . . . . . . . . . . . . 24
14.5 Gain reduction . . . . . . . . . . . . . . . . . . . . . . . . 25
14.6 Device synchronization . . . . . . . . . . . . . . . . . . 26
14.7 Thermal behavior (printed-circuit board
considerations) . . . . . . . . . . . . . . . . . . . . . . . . 26
14.8 Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 27
14.9 SE curves measured in reference design . . . . 29
14.10 BTL curves measured in reference design . . . 33
14.11 Typical application schematics (simplified) . . . 37
15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 41
16 Soldering of SMD packages . . . . . . . . . . . . . . 43
16.1 Introduction to soldering . . . . . . . . . . . . . . . . . 43
16.2 Wave and reflow soldering . . . . . . . . . . . . . . . 43
16.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 43
16.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 44
17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 45
18 Revision history . . . . . . . . . . . . . . . . . . . . . . . 46
19 Legal information . . . . . . . . . . . . . . . . . . . . . . 47
19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 47
19.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
19.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 47
19.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 47
20 Contact information . . . . . . . . . . . . . . . . . . . . 47
21 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48