NXP Semiconductors TDA8932B - Manual (Page 42)

TDA8932B_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 18 December 2008 42 of 48
NXP Semiconductors
TDA8932B
Class-D audio amplifier
Fig 41. Package outline SOT549-1 (HTSSOP32)
UNIT A1 A2 A3 bp c D (1) E (2) e HE L Lp Z y w v
θ
REFERENCES OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05 8
0
o
o
0.1
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
SOT549-1
03-04-07
05-11-02
w M
θ
A
A1
A2
Eh
Dh
D
L p
detail X
E
Z
exposed die pad side
e
c
L
X
(A3)
0.25
1 16
32 17
y
b
HE
0.95
0.85 0.30
0.19
Dh
5.1
4.9
Eh
3.6
3.4 0.20
0.09 11.1
10.9 6.2
6.0 8.3
7.9
0.65 1 0.2
0.78
0.48
0.1
0.75
0.50
p
v M A
A
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
SOT549-1
A
max.
1.1
0 2.5 5 mm
scale
pin 1 index
MO-153