Texas Instruments SLOU023A User Manual

Page 17

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The TPA112 MSOP Audio Power Amplifier Evaluation Module

3-3

Details

3.2

The TPA112 MSOP Audio Power Amplifier Evaluation Module

The TPA112 MSOP audio power amplifier evaluation module is powered by
a TPA112 150-mW stereo audio amplifier IC. It can drive either line-level
outputs, 32-

headphones, or 8-

speakers. A single-supply operational

amplifier (TLV2211) on the module provides a buffered midpoint voltage to
properly bias the noninverting inputs of the TPA112 amplifier IC.

The evaluation module can be used with the TI plug-n-play audio amplifier
evaluation platform (Figure 3 –1) or wired directly into circuits or equipment.
The module has single in-line header connector pins mounted to the under
side of the board. These pins allow the module to be plugged into the TI
platform, which automatically makes all the signal input and output, power, and
control connections to the module. The module connection pins are on
0.1-inch centers to allow easy use with standard perf board and plug
board-based prototyping systems. Or, the EVM can be wired directly into
existing circuits and equipment when used stand-alone.

The module appears in Figure 3–2 and its schematic is shown in Figure 3 – 3.

Figure 3–2. TPA112 MSOP EVM

GND

Vo2

IN2–

IN2+

Vdd

GND

IN1+

U2

C7 R9

C1

C5

Vo1

GND

TEXAS

INSTRUMENTS

SLOP126

TPA112 MSOP EVM

C6

R10

R8

R7

C4

R1
R2
R3
R4
C2

R5

R6

C3

JP1

IN1–

+

† Due to the very small size of the MSOP IC package, the standard part number TPA112 is replaced with the code TIAAD

Figure 3–3. TPA112 MSOP EVM Schematic Diagram

IN 1–

Vo1

VDD

Vo2

GND

IN 2–

C3

1

µ

F

R7

20 k

C4

0.1

µ

F

8

7

6

5

1

2

3

4

Vo2

Audio

Input 1

R10
82 k

TPA112

MSOP

C6

1

µ

F

+

VDD
2.5 to 5.5 V

GND

C5

10

µ

F

Vo1

R8
82 k

IN 1+

IN 2+

R9

20 k

C7

0.1

µ

F

Audio

Input 2

R1

20 k

C1

0.1

µ

F

R4

20 k

C2

0.1

µ

F

_

+

R6, 20 k

R5

20 k

VDD

Mid

Mid

R2

82 k

R3

82 k

U1

U2

IN +

IN –

IN +

IN –

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