English 1.2 specifications – ASRock B75M-DGS User Manual

Page 5

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ASRock B75M-DGS Motherboard

English

1.2 Specifications

Platform

- Micro ATX Form Factor: 8.9-in x 7.2-in, 22.6 cm x 18.3 cm

- All Solid Capacitor design

CPU

- Supports 3

rd

and 2

nd

Generation Intel

®

Core

TM

i7 / i5 / i3 in

LGA1155 Package

- 3 + 1 Power Phase Design

- Supports Intel

®

Turbo Boost 2.0 Technology

- Supports Hyper-Threading Technology (see CAUTION 1)

Chipset

- Intel

®

B75

- Supports Intel

®

Small Business Advantage (see CAUTION 2)

- Supports Intel

®

Rapid Start Technology and Smart Connect

Technology

Memory

- Dual Channel DDR3 Memory Technology (see CAUTION 3)

- 2 x DDR3 DIMM slots

- Supports DDR3 1600/1333/1066 non-ECC, un-buffered

memory (DDR3 1600 with Intel

®

Ivy Bridge CPU, DDR3

1333 with Intel

®

Sandy Bridge CPU)

- Max. capacity of system memory: 16GB (see CAUTION 4)

- Supports Intel

®

Extreme Memory Profi le (XMP)1.3/1.2

Expansion Slot

- 1 x PCI Express 3.0 x16 slot (PCIE1: x16 mode)

(see CAUTION 5)

* PCIE 3.0 is only supported with Intel

®

Ivy Bridge CPU. With

Intel

®

Sandy Bridge CPU, it only supports PCIE 2.0.

- 1 x PCI Express 2.0 x1 slot

Graphics *

Intel

®

HD Graphics Built-in Visuals and the VGA outputs can

be supported only with processors which are GPU

integrated.

- Supports Intel

®

HD Graphics Built-in Visuals: Intel

®

Quick

Sync Video 2.0, Intel

®

InTru

TM

3D, Intel

®

Clear Video HD

Technology, Intel

®

Insider

TM

, Intel

®

HD Graphics 2500/4000

- Pixel Shader 5.0, DirectX 11 with Intel

®

Ivy Bridge CPU.

Pixel Shader 4.1, DirectX 10.1 with Intel

®

Sandy Bridge CPU

- Max. shared memory 1760MB (see CAUTION 6)

- Dual VGA Output: support DVI and D-Sub ports by

independent display controllers

- Supports DVI with max. resolution up to 1920x1200 @ 60Hz

- Supports D-Sub with max. resolution up to 2048x1536 @

75Hz

- Supports HDCP function with DVI port

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