Rainbow Electronics W25Q32 - Manual (Page 57)

W25Q80, W25Q16, W25Q32
Publication Release Date: June 20, 2007
- 57 - Advanced - Revision A5
12.5 16-Pin SOIC 300-mil (Winbond Package Code SF)
MILLIMETERS INCHES
SYMBOL
MIN MAX MIN MAX
A 2.36 2.64 0.093 0.104
A1 0.10 0.30 0.004 0.012
b 0.33 0.51 0.013 0.020
C 0.18 0.28 0.007 0.011
D
(3)
10.08 10.49 0.397 0.413
E 10.01 10.64 0.394 0.419
E1
(3)
7.39 7.59 0.291 0.299
e
(2)
1.27 BSC 0.050 BSC
L 0.39 1.27 0.015 0.050
θ
0 o 8 o 0 o 8 o
y --- 0.076 --- 0.003
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.