Thermal resistance coefficients(1), Thermal resistance coefficients – Rainbow Electronics AT17LV040 User Manual
Page 14
14
AT17LV65/128/256/512/010/002/040
2321D–CNFG–10/02
Notes:
1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site.
2. Airflow = 0 ft/min.
Thermal Resistance Coefficients
(1)
Package Type
AT17LV65/
AT17LV128/
AT17LV256
AT17LV512/
AT17LV010
AT17LV002
AT17LV040
8CN4
Leadless Array Package (LAP)
q
JC
[
°
C/W]
45
45
45
–
q
JA
[
°
C/W]
(2)
115.71
135.71
159.60
–
8P3
Plastic Dual Inline Package (PDIP)
q
JC
[
°
C/W]
37
37
–
–
q
JA
[
°
C/W]
(2)
107
107
–
–
8S1
Plastic Gull Wing Small Outline
(SOIC)
q
JC
[
°
C/W]
45
–
–
–
q
JA
[
°
C/W]
(2)
150
–
–
–
20J
Plastic Leaded Chip Carrier
(PLCC)
q
JC
[
°
C/W]
35
35
35
–
q
JA
[
°
C/W]
(2)
90
90
90
–
20S2
Plastic Gull Wing Small Outline
(SOIC)
q
JC
[
°
C/W]
–
q
JA
[
°
C/W]
(2)
–
44A
Thin Plastic Quad Flat Package
(TQFP)
q
JC
[
°
C/W]
–
–
17
17
q
JA
[
°
C/W]
(2)
–
–
62
62
44J
Plastic Leaded Chip Carrier
(PLCC)
q
JC
[
°
C/W]
–
–
15
15
q
JA
[
°
C/W]
(2)
–
–
50
50