GE Industrial Solutions EVW010A0B Series (Eighth-Brick) - Manual (Page 10)

Data Sheet
September 4, 2013
EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 10
Thermal Considerations (continued)
O
U
TPU
T
CUR
RE
NT,
I O
(A
)
3
4
5
6
7
8
9
10
20 30 40 50 60 70 80 90
1.0 m/s
(200LFM)
0.5 m/s
(100LFM)
NC
AMBIENT TEMEPERATURE, T
A
( o C )
Figure 19. Output Current Derating for the Module
with Heatplate and 1.0 in. heatsink; Airflow in the
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Through-Hole Soldering Information
The RoHS-compliant (Z codes) through-hole products
use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-
compliant components. The RoHS-compliant with
lead solder exemption (non-Z codes) through-hole
products use Sn/Pb solder and RoHS-compliant
components. Both non-Z and Z codes are designed to
be processed through single or dual wave soldering
machines. The pins have an RoHS-compliant finish
that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of
3
C/s is suggested. The wave preheat process
should be such that the temperature of the power
module board is kept below 210
C. For Pb solder,
the recommended pot temperature is 260 C, while the
Pb-free solder pot is 270 C max. Not all RoHS-
compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reflow process.
If additional information is needed, please consult with
your Lineage Power representative for more details.
Surface Mount Information
Pick and Place
The EVW010A0B modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
o C. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 20. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Reflow Soldering Information
The surface mountable modules in the EVW family
use our newest SMT technology called “Column Pin”
(CP) connectors. Figure 21 shows the new CP
connector before and after reflow soldering onto the
end-board assembly.
EVW Bo ard
Insu la tor
Sold er Ba ll
End assem bly PCB
Figure 21. Column Pin Connector Before and After
Reflow Soldering.
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag/Cu
(SAC) solder for –Z codes. The CP connector design
is able to compensate for large amounts of co-
planarity and still ensure a reliable SMT solder joint.
Typically, the eutectic solder melts at 183
o C (Sn/Pb
solder) or 217-218 o C (SAC solder), wets the land,
and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on
the connection to ensure a reliable solder joint. There
are several types of SMT reflow