GE Industrial Solutions EHHD015A0A Hammerhead Series - Manual (Page 11)

GE Data Sheet
EHHD015A0A Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 11
Through-Hole Soldering Information
Lead-Free Soldering
The EHHD015A0Axx RoHS-compliant through-hole products
use SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed through
single or dual wave soldering machines. The pins have a
RoHS-compliant finish that is compatible with both Pb and
Pb-free wave soldering processes. A maximum preheat rate
of 3C/s is suggested. The wave preheat process should be
such that the temperature of the power module board is
kept below 210C. For Pb solder, the recommended pot
temperature is 260C, while the Pb-free solder pot is 270C
max.
Paste-in-Hole Soldering
The EHHD015A0Axx module is compatible with reflow
paste-in-hole soldering processes shown in Figures 25-27.
Since the EHHD015A0AxxZ module is not packaged per J-
STD-033 Rev.A, the module must be baked prior to the
paste-in-hole reflow process. EHHD015A0Axx-HZ modules
are not compatible with paste-in-hole reflow soldering.
Please contact your GE Sales Representative for further
information.
Surface Mount Information
MSL Rating
The EHHD015A0A-SZ module has a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages
is detailed in J-STD-033 Rev. A (Handling,
Surface Mount Information (continued)
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture barrier bags (MBB) with
desiccant are provided for the EHHD015A0Axx-SZ modules.
These sealed packages should not be broken until time of
use. Once the original package is broken, the floor life of the
product at conditions of  30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A). The
shelf life for dry packed SMT packages is a minimum of 12
months from the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity
.
Pick and Place
The EHHD015A0A modules use an open frame construction
and are designed for a fully automated assembly process.
The modules are fitted with a label designed to provide a
large surface area for pick and place operations. The label
meets all the requirements for surface mount processing, as
well as safety standards, and is able to withstand reflow
temperatures of up to 300
o C. The label also carries product
information such as product code, serial number and the
location of manufacture.
Figure 24. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be
considered to optimize this process. The minimum
recommended nozzle diameter for reliable operation is
6mm. The maximum nozzle outer diameter, which will safely
fit within the allowable component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be used
within the space available.
Reflow Soldering Information
The surface mountable modules in the EHHD family use our
newest SMT technology called “Column Pin” (CP) connectors.
Figure 25 shows the new CP connector before and after
reflow soldering onto the end-board assembly. The CP is
constructed from a solid copper pin with an integral solder
ball attached, which is composed of tin/lead (Sn/Pb) solder
for non-Z codes, or Sn/Ag
3
/Cu (SAC) solder for –Z codes.
EHHD Board
Insulator
Solder Ball
End assembly PCB
Figure 25. Column Pin Connector Before and After Reflow
Soldering .
The CP connector design is able to compensate for large
amounts of co-planarity and still ensure a reliable SMT
solder joint. Typically, the eutectic solder melts at 183 o C
(Sn/Pb solder) or 217-218 o C (SAC solder), wets the land, and
subsequently wicks the device connection. Sufficient time
must be allowed to fuse the plating on the connection to
ensure a reliable solder joint. There are several types of SMT
reflow technologies currently used in the industry. These
surface mount power modules can be reliably soldered
using natural forced convection, IR (radiant infrared), or a
combination of convection/IR. The following instructions
must be observed when SMT soldering these units. Failure to
observe these instructions may result in the failure of or
cause damage to the modules, and can adversely affect
long-term reliability.