GE Industrial Solutions HW006-010-012 Series - Manual (Page 18)

Lineage Power 18
Data Sheet
June 26, 2009
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Through-Hole Lead-Free Soldering Infor-
mation
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant components.
They are designed to be processed through single or dual
wave soldering machines. The pins have an RoHS-compli-
ant finish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of 3°C/s is
suggested. The wave preheat process should be such that
the temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot temperature is
260°C, while the Pb-free solder pot is 270°C max. Not all
RoHS-compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reflow process. If
additional information is needed, please consult with your
Lineage Power representative for more details.
Surface Mount Information
Pick and Place Area
Although the module weight is minimized by using open-
frame construction, the modules have a relatively large mass
compared to conventional surface-mount components. To
optimize the pick-and-place process, automated vacuum
equipment variables such as
nozzle size, tip style, vacuum pressure, and placement
speed should be considered. Surface-mount versions of this
family have a flat surface which serves as a
pick-and-place location for automated vacuum equipment.
The module’s pick-and-place location is identified in Figure
49.
Figure 49. Pick and Place Location.
Z Plane Height
The 'Z' plane height of the pick and place location is 7.50mm
nominal with an RSS tolerance of +/-0.25 mm.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, they have a relatively
large mass when compared with conventional SMT compo-
nents. Variables such as nozzle size, tip style, vacuum pres-
sure and placement speed should be considered to optimize
this process.
The minimum recommended nozzle diameter for reliable
operation is 6mm. The maximum nozzle outer diameter,
which will safely fit within the allowable component spacing,
is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be used
within the space available.
For further information please contact your local Lineage
Power Technical Sales Representative.
Reflow Soldering Information
The HW006 family of power modules is available for either
Through-Hole (TH) or Surface Mount (SMT) soldering.
These power modules are large mass, low thermal resis-
tance devices and typically heat up slower than other SMT
components. It is recommended that the customer review
data sheets in order to customize the solder reflow profile for
each application board assembly.
The following instructions must be observed when SMT sol-
dering these units. Failure to observe these instructions may
result in the failure of or cause damage to the modules, and
can adversely affect long-term reliability.
The surface mountable modules in the HW006 family use our
newest SMT technology called "Column Pin" (CP) connec-
tors. Figure 50 shows the new CP connector before and after
reflow soldering onto the end-board assembly.
Figure 50. Column Pin Connector Before and After
Reflow Soldering.
The CP is constructed from a solid copper pin with an integral
solder ball attached, which is composed of tin/lead (Sn/Pb)
solder. The CP connector design is able to compensate for
large amounts of co-planarity and still ensure a reliable SMT
solder joint.
Typically, the eutectic solder melts at 183oC, wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection to
ensure a reliable solder joint. There are several types of
SMT reflow technologies currently used in the industry.
These surface mount power modules can be reliably sol-
dered using natural forced convection, IR (radiant infrared),
or a combination of convection/IR. For reliable soldering the
solder reflow profile should be established by accurately
measuring the modules CP connector temperatures.
X
21mm
(0.84in)
14mm
(0.57in)
HW006 Board
Insulator
Solder Ball
End assembly PCB