GE Industrial Solutions HW-HC004-005-006 Series - Manual (Page 19)

Data Sheet
October 4, 2013
HW/HC004/005/006 Series DC-DC Power Module:
18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
LINEAGE POWER 19
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference point, T
ref
used in the
specifications is shown in Figure 66. For reliable
operation this temperature should not exceed 115
o
C.
Figure 66. T
ref
Temperature Measurement Location.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating figures showing the
maximum output current that can be delivered by each
module versus local ambient temperature (T
A
) for natural
convection and up to 3m/s (600 ft./min) are shown in the
respective Characteristics Curves section.
EMC Considerations
The figure 67 shows a suggested configuration to meet
the conducted emission limits of EN55022 Class B.
Vin+
HW005
Vin-
Vout+
Vout-
L1 - CMC
C6 56nF
C5 56nF
C1
0.68uF
C4
33uF
100V
C2
0.68uF
Pulse P0354
C3
0.68uF
L2
10uH
Figure 67. Suggested Configuration for EN55022
Class B.
100K 500K 1M 5M 10M 30M
Frequency(Hz)
10
20
30
40
50
60
70
80
90
Lev
el
(
dB
µ
V
)
EN 55022 Class B Conducted Average dBuV
Figure 68. EMC signature using above filter,
HW005A0F.
For further information on designing for EMC
compliance, please refer to the FLTR100V10 data sheet
(FDS01-043EPS).
Layout Considerations
The HW/HC005 power module series are low profile in
order to be used in fine pitch system card architectures.
As such, component clearance between the bottom of
the power module and the mounting board is limited.
Avoid placing copper areas on the outer layer directly
underneath the power module. Also avoid placing via
interconnects underneath the power module.
For additional layout guide-lines, refer to FLTR100V10
data sheet.