Soldering footprint – Diodes ZXGD3101T8 User Manual

Page 12

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ZXGD3101T8

Issue 4 - January 2009

12

www.zetex.com

© Diodes Incorporated 2009

www.diodes.com

Package information - SM8 (Surface mounted, 8 pin package)

Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches

Soldering footprint

DIM

Millimeters

Inches

DIM

Millimeters

Inches

Min.

Max.

Typ.

Min.

Max.

Typ.

Min.

Max.

Typ.

Min.

Max.

Typ.

A

-

1.7

-

-

0.067

-

e1

-

-

4.59

-

-

0.1807

A1

0.02

0.1

-

0.0008

0.004

-

e2

-

-

1.53

-

-

0.0602

b

-

-

0.7

-

-

0.0275

He

6.7

7.3

-

0.264

0.287

-

c

0.24

0.32

-

0.009

0.013

-

Lp

0.9

-

-

0.035

-

-

D

6.3

6.7

-

0.248

0.264

-

-

15°

-

-

15°

-

E

3.3

3.7

-

0.130

0.145

-

-

-

10°

-

-

10°

2.8

0.110

6.8

0.268

4.6

0.181

0.95

0.037

1.52

0.060

mm

inches

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