Component selection, Layout considerations – Diodes ZXGD3102 User Manual

Page 9

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Issue 4, May 2009

9

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©Diodes Incorporated 2008

ZXGD3102T8

Component Selection

It is advisable to decouple the ZXGD3102 closely to V

CC

and ground due to the possibility of high peak

gate currents, as indicated by C1 in Figure 4. In applications where the input voltage is higher than
12V, it is recommended to use a Zener diode, ZD1 as shown in the Typical Application Circuit on page
1, and in Figure 2, in order to limit the V

CC

supply voltage to the ZXGD3102 and also to limit the

maximum voltage applied to the gate of the MOSFET. A suitable value for the Zener is 10V.

The proper selection of external resistors R

REF

and R

BIAS

is important to the optimum device operation.

Select a value for resistor R

REF

to give a reference current, I

REF

, of ~2.4mA. The value of R

BIAS

must

then be selected to give a bias current, I

BIAS

, of approximately 1.2 times I

REF

. This set the turn-off

threshold voltage V

T

of the controller to ‘-24mV’ at V

CC

=10V.

R

REF

= (V

CC

-0.7V)/ 0.0024

R

BIAS

= (V

CC

-0.7V)/ 0.0028

Alternatively, R

REF

and R

BIAS

can be chosen to be equal to set the turn-off threshold voltage V

T

to ‘-

29mV’ at V

CC

=10V. This also reduces the IC current consumption when the gate voltage is off.

External gate resistor to GATEH pin is optional. It can be inserted to control the turn-on gate rise time
which may help with in-rush current protection, EMI issues or power dissipation within the part. The
addition of C

BIAS

controls the switch-on delay of the MOSFET, and ensures stability. A suitable value

is 1nF.

Layout considerations

The Gate pins should be as close to the MOSFET gate as possible. Also the ground return loop
should be as short as possible. The decoupling capacitor should be close to the V

CC

and Ground pin,

and should be a X7R type. Trace widths should be maximized in the high current path through the
MOSFET and ground return in order to minimize the effects of circuit inductance and resistance.

For best thermal performance, the PCB heat path from pins 5 and 6 needs attention. The area of
copper connected to pins 5 and 6 should be maximised.

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