Diodes ZXMN2AMC - Manual (Page 3)

ZXMN2AMC
Document number: DS35089 Rev. 1 - 2
3 of 8
www.diodes.com
December 2010
© Diodes Incorporated
ZXMN2AMC
A Product Line of
Diodes Incorporated
Thermal Characteristics
1 10
10m
100m
1
10
0 25 50 75 100 125 150
0.0
0.5
1.0
1.5
2.0
100µ 1m 10m 100m 1 10 100 1k
0
20
40
60
80
0.1 1 10 100
0
25
50
75
100
125
150
175
200
225
0.1 1 10 100
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
8 sq cm 2oz Cu
One active die 100us
100ms
1s
R
DS(on)
Limited
1ms
Safe Operating Area
Single Pulse, T
amb
=25°C
DC
10ms
I D
Dr
ain Cur
re
n
t (A
)
V
DS
Drain-Source Voltage (V)
10 sq cm 1oz Cu
One active die
10 sq cm 1oz Cu
Two active die
8 sq cm 2oz Cu
One active die
Derating Curve
M
a
x
P
o
we
r
Dis
s
ipat
ion
(W
)
Temperature (°C)
8 sq cm 2oz Cu
One active die
D=0.2
D=0.5
D=0.1
Transient Thermal Impedance
Single Pulse
D=0.05
The
rm
al
R
esi
st
anc
e (
°C
/W
)
Pulse Width (s)
2oz Cu
Two active die
1oz Cu
Two active die
1oz Cu
One active die
2oz Cu
One active die
2oz Cu
Two active die
Thermal Resistance v Board Area
The
rm
al
R
esi
st
anc
e (
°C
/W
)
Board Cu Area (sqcm)
1oz Cu
One active die
1oz Cu
Two active die
2oz Cu
One active die
Power Dissipation v Board Area
T
amb
=25°C
T
j max
=150°C
Continuous
P
D
Di
s
s
ipa
ti
on
(W)
Board Cu Area (sqcm)