Zxmn3b04n8 – Diodes ZXMN3B04N8 User Manual
Page 7
ZXMN3B04N8
S E M I C O N D U C T O R S
ISSUE 2 - MAY 2004
Europe
Zetex GmbH
Streitfeldstraße 19
D-81673 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
[email protected]
Americas
Zetex Inc
700 Veterans Memorial Hwy
Hauppauge, NY 11788
USA
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
[email protected]
Asia Pacific
Zetex (Asia) Ltd
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong
Telephone: (852) 26100 611
Fax: (852) 24250 494
[email protected]
Corporate Headquarters
Zetex plc
Lansdowne Road, Chadderton
Oldham, OL9 9TY
United Kingdom
Telephone (44) 161 622 4444
Fax: (44) 161 622 4446
[email protected]
These offices are supported by agents and distributors in major countries world-wide.
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
For the latest product information, log on to
© Zetex Semiconductors plc 2004
7
DIM
Inches
Millimeters
DIM
Inches
Millimeters
Min
Max
Min
Max
Min
Max
Min
Max
A
0.053
0.069
1.35
1.75
e
0.050 BSC
1.27 BSC
A1
0.004
0.010
0.10
0.25
b
0.013
0.020
0.33
0.51
D
0.189
0.197
4.80
5.00
c
0.008
0.010
0.19
0.25
H
0.228
0.244
5.80
6.20
⍜
0
Њ
8
Њ
0
Њ
8
Њ
E
0.150
0.157
3.80
4.00
h
0.010
0.020
0.25
0.50
L
0.016
0.050
0.40
1.27
PACKAGE DIMENSIONS
Controlling dimensions are in inches. Approximate conversions are given in millimeters
D
E
H
L
C
E
B
S EATING P LANE
P IN 1
A1
A
⍜
PACKAGE OUTLINE