Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes ZXM66P02N8 User Manual

Page 2: A product line of diodes incorporated

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ZXM66P02N8

Document Number DS31965 Rev. 2 - 2

2 of 5

www.diodes.com

October 2009

© Diodes Incorporated

A Product Line of

Diodes Incorporated

ZXM66P02N8





Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Unit

Drain-Source voltage

V

DSS

-20 V

Gate-Source voltage

V

GS

±12

V

Continuous Drain current

V

GS

= 4.5V

(Note 3)

I

D

-8.0

A

T

A

= 70°C (Note 3)

-6.5

(Note 2)

-6.4

Pulsed Drain current

(Note 4)

I

DM

-28 A

Continuous Source current (Body diode)

(Note 3)

I

S

-4.15 A

Pulsed Source current (Body diode)

(Note 4)

I

SM

-28 A


Thermal Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Unit

Power dissipation
Linear derating factor

(Note 2)

P

D

1.56
12.5

W

mW/

°C

(Note 3)

2.5

20

Thermal Resistance, Junction to Ambient

(Note 2)

R

θJA

80

°C/W

(Note 3)

50

Operating and storage temperature range

T

J

, T

STG

-55 to 150

°C


Notes:

2. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
3. Same as note (3), except the device is measured at t

≤ 10 sec.

4. Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10

μs – pulse width limited by maximum junction temperature.

Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS

Drain-Source Breakdown Voltage

BV

DSS

-20

V

I

D

= -250

μA, V

GS

= 0V

Zero Gate Voltage Drain Current

I

DSS

-1

μA

V

DS

= -16V, V

GS

= 0V

Gate-Source Leakage

I

GSS

-100 nA

V

GS

=

±12V, V

DS

= 0V

ON CHARACTERISTICS

Gate Threshold Voltage

V

GS(th)

-0.7

V

I

D

= -250

μA, V

DS

= V

GS

Static Drain-Source On-Resistance (Note 5)

R

DS (ON)

0.025

V

GS

= -4.5V, I

D

= -3.2A

0.045

V

GS

= -2.5V, I

D

= -2.7A

Forward Transconductance (Notes 5 & 6)

g

fs

13.3

S

V

DS

= -10V, I

D

= -3.2A

Diode Forward Voltage (Note 5)

V

SD

0.95 V

I

S

= -3.2A, V

GS

= 0V

Reverse recovery time (Note 6)

t

rr

23.1

ns

I

F

= -3.2A, di/dt = 100A/

μs

Reverse recovery charge (Note 6)

Q

rr

12.2

nC

DYNAMIC CHARACTERISTICS (

Note 6

)

Input Capacitance

C

iss

2068

pF

V

DS

= -15V, V

GS

= 0V

F = 1MHz

Output Capacitance

C

oss

1038

pF

Reverse Transfer Capacitance

C

rss

506

pF

Total Gate Charge (Note 7)

Q

g

43.3

nC

V

GS

= -4.5V, V

DS

= -10V,

I

D

= -3.2A

Gate-Source Charge (Note 7)

Q

gs

3.5

nC

Gate-Drain Charge (Note 7)

Q

gd

21.3

nC

Turn-On Delay Time (Note 7)

t

D(on)

14.0

ns

V

DD

= -10V, V

GS

= -5V

I

D

= -3.2A, R

G

= 6.0

Ω

Turn-On Rise Time (Note 7)

t

r

44.3

ns

Turn-Off Delay Time (Note 7)

t

D(off)

118.4

ns

Turn-Off Fall Time (Note 7)

t

f

98.4

ns

Notes:

5. Measured under pulsed conditions. Pulse width

≤ 300μs; duty cycle ≤ 2%

6. For design aid only, not subject to production testing.
7. Switching characteristics are independent of operating junction temperatures.

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