Zxm64p03x, Maximum ratings, Thermal characteristics – Diodes ZXM64P03X User Manual

Page 2

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ZXM64P03X

Document Number DS33487 Rev. 2 - 2

2 of 7

www.diodes.com

October 2012

© Diodes Incorporated

A Product Line of

Diodes Incorporated

ZXM64P03X




Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

-30 V

Gate-Source Voltage

V

GS

±20 V

Continuous Drain Current

V

GS

= 4.5V

T

A

= +25°C (Note 5)

T

A

= +70°C (Note 5)

I

D

-3.8
-3.0

A

Pulsed Drain Current (Note 7)

I

DM

-1.9 A

Continuous Source Current (Body Diode) (Note 6)

I

S

-2.3 A

Pulsed Source Current (Body Diode) (Note 7)

I

SM

-19 A

Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Unit

Power Dissipation (Note 5)
Linear Derating Factor

P

D

1.1
8.8

W

mW/°C

Power Dissipation (Note 6)
Linear Derating Factor

P

D

1.8

14.4

W

mW/°C

Thermal Resistance, Junction to Ambient (Note 5)

R

θJA

113 °C/W

Thermal Resistance, Junction to Ambient (Note 6)

R

θJA

70 °C/W

Thermal Resistance, Junction to Ambient (Note 8)

R

θJL

39.8 °C/W

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C

Notes:

5. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions

6. For a device surface mounted on FR4 PCB measured at t

≤10 secs.

7. Repetitive rating pulse width limited by pulse current limited by maximum junction temperature.
8. Thermal resistance from junction to solder-point (at the end of the Drain lead).

Thermal Characteristics




















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