Diodes ZXMP6A18K - Manual (Page 2)

ZXMP6A18K
Issue 1 - March 2006 2 www.zetex.com
© Zetex Semiconductors plc 2006
Absolute maximum ratings
NOTES:
(a) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in
still air conditions.
(b) For a device surface mounted on FR4 PCB measured at t 10 sec.
(c) Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D=0.02 pulse width=300 s - pulse width limited by maximum
junction temperature.
(d) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in
still air conditions.
Parameter Symbol Limit Unit
Drain-source voltage V
DSS
-60 V
Gate-source voltage V
GS
±20 V
Continuous drain current
I
D
@V
GS
=10V; T
A
=25°C
(b) -10.4 A
@V
GS
=10V; T
A
=70°C
(b) -8.3 A
@V
GS
=10V; T
A
=25°C
(a) -6.8 A
Pulsed drain current
(c) I
DM
-37.5 A
Continuous source current (body diode)
(b) I
S
-11.5 A
Pulsed source current (body diode)
(c) I
SM
-37.5 A
Power dissipation at T
A
=25°C
(a)
Linear derating factor
P
D
4.3
34.4
W
mW/°C
Power dissipation at T
A
=25°C
(b)
Linear derating factor
P
D
10.1
80.8 W
mW/°C
Power dissipation at T
A
=25°C
(d)
Linear derating factor
P
D
2.15
17.2 W
mW/°C
Operating and storage temperature range T
j
:T
stg
-55 to +150 °C
Thermal resistance
Parameter Symbol Value Unit
Junction to ambient
(a) R ⍜JA 29 °C/W
Junction to ambient
(b) R ⍜JA 12.3 °C/W
Junction to ambient
(d) R
⍜JA
58 °C/W